Lid attach process and apparatus for fabrication of semiconductor packages

ABSTRACT

An adhesive dispenser comprises a dispensing head. The dispensing head comprises an adhesive material applicator portion on a first level of the dispensing head. The adhesive material applicator portion corresponds to a periphery of a package. The dispensing head also comprises a thermal interface material (TIM) applicator portion on a second level of the dispensing head different from the first level. The TIM applicator portion corresponds to a die of the package. The dispensing head further comprises an adhesive material conduit configured to supply the adhesive material applicator portion with an adhesive material. The dispensing head additionally comprises a TIM conduit configured to supply the TIM applicator portion with a TIM.

PRIORITY CLAIM

The present application is a divisional of U.S. application Ser. No.13/494,814, filed Jun. 12, 2012, now U.S. Pat. No. 8,916,419, issuedDec. 23, 2014, which claims priority of U.S. Provisional PatentApplication No. 61/617,383, filed Mar. 29, 2012, which are incorporatedherein by reference in their entireties.

FIELD

The disclosure relates generally to the fabrication of semiconductorpackages, and more particularly, to a high throughput and accurate lidattach process and apparatus.

BACKGROUND

The assembly of a semiconductor package plays an important role insemiconductor fabrication and thermal management. A conventionalsemiconductor package includes a lid, one or more die, seal adhesive,interconnects, a substrate, and/or a thermal interface material (TIM).

The die is placed on the substrate through a die-attach process.Typically, the die-attach process involves attaching a flip-chip typedie to the substrate by interconnects through a reflow process. In a lidattach process, the seal adhesive is dispensed on a periphery of thesubstrate by a needle-type dispensing head, for example, for attachingthe lid later. The TIM is applied to a bottom side of the die (i.e., theside opposite the interconnects) by the needle-type dispensing head. Anunderfill may be applied to the interconnects, the die, and thesubstrate to at least reduce stress to the semiconductor package. Thelid is thereafter placed on the substrate, typically making contact withthe seal adhesive and the die by way of the TIM.

In the conventional lid attach process, the needle-type dispensing headis often used for both dispensing the seal adhesive and the TIM. Theseal adhesive and TIM are typically contained in a container such as aflask or vial and dispensed through tubes in the needle-type dispensinghead by capillary action. There are disadvantages, however in dispensingeither the seal adhesive or TIM via the needle-type dispensing headprocess. For large or small die applications, the throughput can bereduced due to the time needed to apply complicated TIM dispensingpatterns to the die. FIG. 1 is a plan view of a semiconductor packageundergoing a stage of fabrication where a complicated dispensing pattern10 has been applied to a top of the die 20. Further, the seal adhesivemay be improperly dispensed on the substrate. These may cause voids onthe substrate or the seal adhesive may shift from the correct dispensingpattern 10 thereby compromising the integrity of the semiconductorpackage. FIG. 1 shows an example of seal adhesives 30 applied on theperiphery of substrate 70 and a seal adhesive 40 that has shifted fromits intended location 50. Further still, in the needle-type dispensingprocess, the dispensing pattern and weight may be difficult to controlleading to insufficient TIM coverage on the die or insufficient adhesivecoverage on the substrate.

BRIEF DESCRIPTION OF DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a plan view of a semiconductor package showing a dispensingpattern applied to the top of a die.

FIG. 2a is a cross-sectional view of a semiconductor package having adie attached to a substrate undergoing a stage of lid attachment whereadhesive material is attached to the substrate, according to aspects ofthe present disclosure.

FIG. 2b is a side view of a stamp-type dispensing head of an adhesivedispenser, according to one embodiment of the present disclosure.

FIG. 2c is a bottom view of the stamp-type dispensing head of FIG. 2b ,according to one embodiment of the present disclosure.

FIG. 3a is a cross-sectional view of the semiconductor package of FIG.2a showing a further step of applying a thermal interface material (TIM)on top of the die, according to aspects of the present disclosure.

FIG. 3b is a side view of a stamp-type dispensing head of a TIMdispenser, according to an embodiment of the present disclosure.

FIG. 3c is a bottom view of the stamp-type dispensing head of FIG. 3b ,according to one embodiment of the present disclosure.

FIG. 4 is a cross-sectional view of the semiconductor package of FIG. 3ashowing the package undergoing a further step of attaching a lid to thesubstrate, according to aspects of the present disclosure.

FIG. 5a is a cross-sectional view of a semiconductor package depicting adie attached to a substrate undergoing a stage of lid attachment wherean adhesive material and a TIM are concurrently applied to the substrateand the die, respectively, according to aspects of the presentdisclosure.

FIG. 5b is a side view of a stamp-type dispensing head of a combinationadhesive and TIM dispenser, according to an embodiment of the presentdisclosure.

FIG. 5c is a bottom view of the stamp-type dispensing head of FIG. 5b ,according to one embodiment of the present disclosure.

FIG. 6 is a cross-sectional view of the semiconductor package of FIG. 5ashowing the package undergoing a further step of attaching a lid to thesubstrate, according to aspects of the present disclosure.

FIG. 7 is a cross-sectional view of a semiconductor package undergoing alid attachment process where TIM is applied to a top of a die by stencilprinting, according to various aspects of the present disclosure.

FIG. 8 is a cross-sectional view of a semiconductor package undergoing alid attachment process where adhesive material is attached to thesubstrate by way of dipping a periphery of a lid in adhesive materialand then attaching the lid to the substrate, according to variousaspects of the present disclosure.

FIG. 9 is a cross-sectional view showing a process of dipping a lid,attached to a lid carrier into a dipping tank in order to apply adhesivematerial to the periphery of the lid, according to one embodiment of thepresent disclosure.

DETAILED DESCRIPTION

In the following description, specific details are set forth to providea thorough understanding of embodiments of the present disclosure.However, one having an ordinary skill in the art will recognize thatembodiments of the disclosure can be practiced without these specificdetails. In some instances, well-known structures and processes are notdescribed in detail to avoid unnecessarily obscuring embodiments of thepresent disclosure.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the present disclosure. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” invarious places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments. It should be appreciated that the followingfigures are not drawn to scale; rather, these figures are merelyintended for illustration. For convenience of illustration and ease ofunderstanding, the features and dimensions of the semiconductor packagehave been exaggerated in some aspects. However, one skilled in the artwill appreciate that, in an actual device, these features may haverelative dimensions that are different from those suggested in thefigures.

FIGS. 2a, 3a , and 4 are cross-sectional side views of a semiconductorpackage 5 at various stages of fabrication undergoing a lid attachprocess, according to an embodiment of the present disclosure. Thesemiconductor package 5 placed on a supporting boat or carrier 60undergoes a lid attach process starting from a right side going to aleft, as indicated by an arrow pointing to the left in these figures. Itis understood that FIGS. 2a, 3a , and 4 have been simplified for abetter understanding of the inventive concepts of the presentdisclosure. FIG. 2a shows semiconductor package 5 having a die 20 (suchas a microprocessor, a chipset, a memory device, an ASIC, any heatgenerating device, or the like), illustrated as a flip-chip attached toa substrate 70, which may be a motherboard, interposer, a back surfaceof another dice, or the like. Die 20 may comprise of one or more dies.By way of a die-attach process, die 20 is attached to substrate 70 byinterconnects 90, such as solder bumps or solder balls. An underfill100, as known in the art, may be disposed between die 20, interconnects90, and the substrate 70 to strengthen the semiconductor package 5,prevent bump cracks, and/or enhance thermal dissipation of package.

According to an aspect of the present disclosure, an adhesive material110 is dispensed on the substrate 70. Adhesive material 110 may compriseany material suitable for sealing a lid onto substrate 70, such asepoxies, urethane, polyurethane, silicone elastomers, and the like. Inone embodiment, adhesive material 110 is a wet-dispensed adhesive suchas SYLGARD® 577, EA6700 or EA6900 all produced by Dow Corning (Midland,Mich., USA). The adhesive material 110 is generally wet dispensed to anouter portion or a periphery or edges of substrate 70 by means of anadhesive dispenser 115 having a stamp-type dispensing head 120. FIG. 2bis a side view of the stamp-type dispensing head 120 of adhesivedispenser 115, and FIG. 2c is a bottom view of the stamp-type dispensinghead 120 showing adhesive material 110 attached to the stamp-typedispensing head 120, according to one embodiment of the presentdisclosure. The adhesive material 110 attached to the stamp-typedispensing head 120 may include a contiguous or non-contiguous pattern,as is understood by those skilled in the art. The adhesive dispenser 115includes a container (not shown), such as a syringe for storing theadhesive material 110 and the stamp-type dispensing head 120 includesone or more conduits 125. By an interaction force, such as for example,a pump extrusion force or a rotary pump extrusion force, the adhesivematerial 110 is pumped from the syringe into the one or more conduits(adhesive material 110 flow shown by arrows) and out through theorifice(s) 130 for application to substrate 70. It is understood thatthe conduits 125 may be arranged in the stamp-type dispensing head 120differently from the one(s) shown in FIG. 2b and that any number ofarrangements may be contemplated.

Following application of the adhesive material 110 to the substrate 70,FIG. 3a shows the semiconductor package 5 undergoing a further step ofapplying a thermal interface material (TIM) 150 to the top of die 20,according to aspects of the present disclosure. The thermal interfacematerial 150 may include but is not limited to, thermal grease,phase-change material, metal filled polymer matrix, and solder [alloysof lead, tin, indium, silver, copper, bismuth, and the like (mostpreferred is indium or lead/tin alloy]). If the thermal interfacematerial 150 is a solid, it may be heated to a temperature at which itundergoes a solid to liquid transition and then may be applied in liquidform to the surface of a die.

According to one embodiment of the present disclosure, the TIM 150 isgenerally wet-dispensed to the top of die 20 by means of a TIM dispenser135 having a stamp-type dispensing head 140. FIG. 3b is a side view ofthe stamp-type dispensing head 140 of TIM dispenser 135, and FIG. 3c isa bottom view of the stamp-type dispensing head 140 showing TIM 150attached to the stamp-type dispensing head 140, according to anembodiment of the present disclosure. The TIM dispenser 135 includes acontainer (not shown), such as a syringe for storing the TIM 150 and thestamp-type dispensing head 140 includes one or more conduits 145. By aninteraction force, such as for example, a pump extrusion force or arotary pump extrusion force the TIM 150 is pumped from the syringe intothe one or more conduits (TIM flow shown by arrows) and out through theone ore more orifices 160 for application to a top surface of die 20. Itis understood to one of ordinary skill in the art that the conduits 145may be arranged in the stamp-type dispensing head 140 differently theone(s) shown in FIG. 3b and that any number of arrangements may becontemplated.

According to another embodiment, TIM 150 may be applied to a top surfaceof die 20 by means of stencil printing. FIG. 7 shows semiconductorpackage 5 undergoing a process of stencil printing whereby, in a firststep a stencil 220 is placed over the top surface of the die 20, thestencil 220 having a patterned opening 230 therein. The stencil 220 is athin flat material, such as stainless steel that has one or moreopenings or apertures through which TIM 150 is applied or printed. It isunderstood that any number of stencils, for the application of formingTIM 150 on top of die 20 may be used and any number of patternedopenings 230 may be contemplated. In a second step, TIM 150 isdeposited, preferably in liquid form on top of die 20 in the opening 230of stencil 220. In a third step, excess TIM 150 is squeezed or otherwisescraped off from the opening 230 by a blade or scraper 240 in order toform a generally flat TIM 150, the generally flat TIM 150 being adaptedto interface with a lid that is to be later placed on top of TIM 150. Ina fourth step, the stencil 220 is removed from the top surface of die20. An advantage of applying TIM 150 on die 20 in this manner is thatTIM 150 may be formed on a batch of dies at the same time. Batchprocessing of TIM saves time, increases throughput, and forms uniformTIM dispensing layers when compared to other types of TIM dispensingprocesses, such as needle-type dispensing.

After the TIM 150 is applied to die 20, semiconductor package 5undergoes a further step of attaching a lid 170 to the substrate 70 (asdepicted in FIG. 4). Lid 170 is preferably constructed from a thermallyconductive material, such as copper, copper alloys, aluminum, aluminumalloys, and the like and may be formed of any other suitable materialsfor application of the present disclosure. As shown in FIG. 4, lid 170is positioned over die 20, lowered and thereafter placed on top of theadhesive material 110 and on top of the TIM 150 by a lid carrier 175, tothereby encapsulate and protect the die 20. It is understood thatadditional processes may be performed before, during, or after theadhesive and/or TIM application processes to complete the fabrication ofthe semiconductor device, but these additional processes are notdiscussed herein in detail for the sake of simplicity. For example, heatmay be applied to the semiconductor package 5 to cure the structure byincreasing the temperature of the TIM 150 and the adhesive material 110.

FIGS. 5a and 6 are cross-sectional side views of the semiconductorpackage 5 at various stages of fabrication undergoing a lid attachprocess, according to another embodiment of the present disclosure. Asdiscussed previously, the semiconductor package 5 is placed on thesupporting boat or carrier 60 and undergoes the lid attach processstarting from a right side and going to a left side, as shown by anarrow pointing to the left. It is understood that FIGS. 5a and 6 havebeen simplified for a better understanding of the inventive concepts ofthe present disclosure.

In this embodiment, an adhesive material 110 and a TIM 150 are appliedconcurrently onto a periphery of the substrate 70 and a top surface ofdie 20, respectively by a combination adhesive and TIM dispenser 180having a stamp-type dispensing head 190. FIG. 5b is a side-view of thestamp-type dispensing head 190 of the combination adhesive and TIMdispenser 180, and FIG. 5c is a bottom view of the stamp-type dispensinghead 190 showing both adhesive material 110 and TIM 150 attached to thestamp-type dispensing head 190, according to an embodiment of thepresent invention. The combination adhesive and TIM dispenser 180includes a container (not shown), such as a syringe for storing theadhesive material 110 and TIM 150 and the stamp-type dispensing head 190includes one or more conduits (not shown for simplicity and clarity). Byan interaction force, such as for example, a pump extrusion force or arotary pump extrusion force the adhesive material 110 and TIM aredispensed or pumped from the container or syringe into the respectiveconduits and out through orifice 200 and orifice 210 for application tosubstrate 70 and die 20, respectively. It is understood that theconduits may be arranged in the stamp-type dispensing head 190 in anynumber of configurations contemplated.

Following application of the adhesive material 110 to the substrate 70and TIM 150 to the die 20, FIG. 6 shows the semiconductor package 5undergoing a further step of attaching a lid 170 to the substrate 70.Lid 170 is positioned over die 20, lowered and thereafter placed on topof the adhesive material 110 and TIM 150 by a lid carrier 175 to therebyencapsulate the die 20.

FIG. 8 is a cross-sectional side view of the semiconductor package 5 atvarious stages of fabrication undergoing a lid attach process, accordingto yet another embodiment of the present disclosure. TIM 150 is firstlyapplied on a top surface of die 20. According to one embodiment, TIM 150is applied to die 20 by a TIM dispenser 135 having a stamp-typedispensing head 140. According to another embodiment, TIM 150 is appliedto die 20 by a stencil printing process. As this process was describedabove with reference to FIG. 7, it will not be repeated again. In afurther process of applying the adhesive material 110 to substrate 70,as shown in FIG. 9 the periphery of a lid 170, which is attached to alid carrier 175 is dipped in a dipping tank 250 containing adhesivematerial 110. The adhesive material 110 thereby attaches to theperiphery of the lid 170. With reference back to FIG. 8, lid 170 nowcontaining the adhesive material attached to the periphery thereof isthen positioned over die 20, lowered and thereafter placed on top of TIM150 and substrate 70 with the adhesive material 110 being adapted tointerface with the periphery of the substrate 70.

Advantages of one or more embodiments of the present disclosure mayinclude one or more of the following.

In one or more embodiments, instead of dispensing complicated TIMpatterns on the die, simple and more straightforward patterns can bedispensed on the die. This decreases the time needed to apply acomplicated dispensing pattern thereby increasing the throughput of theassembly process.

In one or more embodiments of the present disclosure, employing astamp-type dispensing head to dispense a layer, such as an adhesivelayer a more uniform dispensing layer can be achieved, providing formore sufficient adhesive coverage on the substrate.

In one or more embodiments of the present disclosure, both the adhesiveand TIM dispensing processes are combined into a single step, therebysaving time and increasing throughput.

In one or more embodiments of the present disclosure, an advantage ofapplying the TIM on a die employing stencil printing permits the TIM tobe formed on a batch of dies at the same time. Batch processing of TIMsaves time, increases throughput, and forms uniform TIM dispensinglayers when compared to other types of TIM dispensing processes, such asneedle-type dispensing.

Although much of the description herein is directed to the dispensing ofadhesive material and/or thermal interface material on a semiconductorpackage in a lid attach process, it is to be understood that aspects ofthe present disclosure may apply broadly to the dispensation of theadhesive material and/or thermal interface material or, for that matter,any other like material in a package structure from which one may wantto attach and/or assemble components in package structures.

The present disclosure has described various exemplary embodiments.

According to one embodiment, a semiconductor package assembly process,comprises attaching one or more dies to a substrate; applying anadhesive material on a periphery of the substrate by an adhesivedispenser; applying a TIM on a top surface of the die; and positioning alid over the one or more dies and placing the lid on top of the adhesivematerial and the TIM by a lid carrier to encapsulate the one or moredies.

According to another embodiment, a semiconductor package assemblyprocess, comprises attaching one or more dies to a substrate; applyingconcurrently an adhesive material on a periphery of the substrate and aTIM on a top surface of the die by a combination adhesive and TIMdispenser; and positioning a lid over the one or more dies and placingthe lid on top of the adhesive material and the TIM by a lid carrier toencapsulate the one or more dies.

According to yet another embodiment, a lid attach process, comprisesattaching one or more dies to a substrate; applying a TIM on a topsurface of the die; providing a lid and dipping the periphery of the lidby a lid carrier in a dipping tank of adhesive material such that theadhesive material attaches to the periphery of the lid; and positioningthe lid over the one or more dies and placing the lid on the top of theTIM with the adhesive material being adapted to interface with theperiphery of the substrate.

According to yet another embodiment, an adhesive dispenser comprises astamp-type dispensing head for applying an adhesive material to asubstrate, the adhesive dispenser having a container for storing theadhesive material and one or more conduits in the stamp-type dispensinghead for dispensing the adhesive material therethrough by a pumpextrusion force.

According to yet another embodiment, a TIM dispenser comprises astamp-type dispensing head for applying a TIM to a die, the TIMdispenser having a container for storing the TIM and one or moreconduits in the stamp-type dispensing head for dispensing the TIM fromthe container and through the one or more conduits by a pump extrusionforce.

According to yet another embodiment, a combination adhesive and TIMdispenser comprises a stamp-type dispensing head for applying anadhesive material to a substrate and a TIM to a die, the combinationdispenser having a container for storing the adhesive material and/orTIM, and one or more conduits in the stamp-type dispensing head fordispensing the adhesive material and/or TIM from the container andthrough the one or more respective conduits by a pump extrusion force.

An aspect of this description relates to an adhesive dispenser comprisesa dispensing head. The dispensing head comprises an adhesive materialapplicator portion on a first level of the dispensing head. The adhesivematerial applicator portion corresponds to a periphery of a package. Thedispensing head also comprises a thermal interface material (TIM)applicator portion on a second level of the dispensing head differentfrom the first level. The TIM applicator portion corresponds to a die ofthe package. The dispensing head further comprises an adhesive materialconduit configured to supply the adhesive material applicator portionwith an adhesive material. The dispensing head additionally comprises aTIM conduit configured to supply the TIM applicator portion with a TIM.

Another aspect of this description relates to a combination adhesive andthermal interface material (TIM) dispenser. The dispenser comprises astamp-type dispensing head configured to apply (1) an adhesive materialto a periphery of a surface of a substrate and (2) a TIM to a topsurface of a die attached to the surface of the substrate. The dispenseralso comprises an adhesive material conduit configured to supply anadhesive material applicator portion of the stamp-type dispensing headwith the adhesive material. The dispenser further comprises a TIMconduit configured to supply a TIM applicator portion of the stamp-typedispensing head with the TIM.

A further aspect of this description relates to a dispensing headcomprising a first applicator region having an adhesive materialapplicator portion. The dispensing head also comprises a secondapplicator region having a thermal interface material (TIM) applicatorportion. The dispensing head further comprises an adhesive materialconduit configured to supply the adhesive material applicator portionwith adhesive material. The dispensing head additionally comprises a TIMconduit configured to supply the TIM applicator portion with TIM. Thedispensing head is configured to apply (1) the adhesive material to aperiphery of a surface of a substrate using the adhesive materialapplicator portion and (2) the TIM to a top surface of a die attached tothe surface of the substrate using the TIM applicator portion. The firstapplicator region and the second applicator region are arranged toaccommodate the die within a cavity between the first applicator regionand the second applicator region.

In the preceding detailed description, specific exemplary embodimentshave been described. It will, however, be apparent to a person ofordinary skill in the art that various modifications, structures,processes, and changes may be made thereto without departing from thebroader spirit and scope of the present disclosure. The specificationand drawings are, accordingly, to be regarded as illustrative and notrestrictive. It is understood that embodiments of the present disclosureare capable of using various other combinations and environments and arecapable of changes or modifications within the scope of the claims.

What is claimed is:
 1. An adhesive dispenser, comprising: a dispensinghead comprising: an adhesive material applicator portion on a firstlevel of the dispensing head, the adhesive material applicator portioncorresponding to an entirety of a periphery of the dispensing head; athermal interface material (TIM) applicator portion on a second level ofthe dispensing head different from the first level, the TIM applicatorportion corresponding to a center of the dispensing head; an adhesivematerial conduit configured to supply the adhesive material applicatorportion with an adhesive material; and a TIM conduit configured tosupply the TIM applicator portion with a TIM.
 2. The adhesive dispenserof claim 1, further comprising: a TIM container from which the TIM issupplied to the TIM applicator portion from the TIM container throughthe TIM conduit.
 3. The adhesive dispenser of claim 1, furthercomprising: an adhesive material container from which the adhesivematerial is supplied to the adhesive material applicator portion throughthe adhesive material conduit.
 4. The adhesive dispenser of claim 3,wherein the adhesive material container is a syringe configured to pumpthe adhesive material into the adhesive material conduit.
 5. Theadhesive dispenser of claim 2, wherein the TIM container is a syringeconfigured to pump the TIM into the TIM conduit.
 6. The adhesivedispenser of claim 1, wherein the dispensing head is a stamp-typedispensing head.
 7. The adhesive dispenser of claim 1, wherein thedispensing head further comprises: a plurality of orifices configured tooutput the adhesive material.
 8. The adhesive dispenser of claim 1,wherein the dispensing head further comprises: a plurality of orificesconfigured to output the TIM.
 9. The adhesive dispenser of claim 1,wherein the dispensing head is configured to concurrently apply theadhesive material and the TIM.
 10. A combination adhesive and thermalinterface material (TIM) dispenser, comprising: a stamp-type dispensinghead configured to concurrently apply (1) an adhesive material to atwo-dimensional arrangement of locations around a periphery of a surfaceof a substrate and (2) a TIM to a top surface of a die attached to thesurface of the substrate, wherein the adhesive material and the TIM aredifferent compositions; an adhesive material conduit configured tosupply an adhesive material applicator portion of the stamp-typedispensing head with the adhesive material; and a TIM conduit configuredto supply a TIM applicator portion of the stamp-type dispensing headwith the TIM.
 11. The combination adhesive and TIM dispenser of claim10, further comprising: a TIM container from which the TIM is suppliedto the TIM applicator portion through the TIM conduit.
 12. Thecombination adhesive and TIM dispenser of claim 10, further comprising:an adhesive material container from which the adhesive material issupplied to the adhesive material applicator portion through theadhesive material conduit.
 13. The combination adhesive and TIMdispenser of claim 12, wherein the adhesive material container is asyringe configured to pump the adhesive material into the adhesivematerial conduit.
 14. The combination adhesive and TIM dispenser ofclaim 11, wherein the TIM container is a syringe configured to pump theTIM into the TIM conduit.
 15. The combination adhesive and TIM dispenserof claim 10, wherein the dispensing head further comprises: a pluralityof orifices configured to output the adhesive material.
 16. Thecombination adhesive and TIM dispenser of claim 10, wherein thedispensing head further comprises: a plurality of orifices configured tooutput the TIM.
 17. A dispensing head, comprising: a first applicatorregion having an adhesive material applicator portion; a secondapplicator region having a thermal interface material (TIM) applicatorportion; an adhesive material conduit configured to supply the adhesivematerial applicator portion with adhesive material; and a TIM conduitconfigured to supply the TIM applicator portion with TIM, wherein thedispensing head is configured to apply (1) the adhesive material to aperiphery of a surface of a substrate using the adhesive materialapplicator portion and (2) the TIM to a top surface of a die attached tothe surface of the substrate using the TIM applicator portion, and thefirst applicator region and the second applicator region are arranged toaccommodate the die within a cavity between the first applicator regionand the second applicator region.
 18. The dispensing head of claim 17,further comprising: a plurality of first orifices configured to outputthe adhesive material; and a plurality of second orifices configured tooutput the TIM.
 19. The dispensing head of claim 17, wherein thedispensing head is configured to concurrently apply the adhesivematerial and the TIM.
 20. The combination adhesive and TIM dispenser ofclaim 10, wherein the two-dimensional arrangement of locations has theshape of a rectangle.